布局与粘合 SCIE

期刊简介估计审稿时候：

Structure and Bonding is a publication which uniquely bridges the journal and book format. Organized into topical volumes, the series publishes in depth and critical reviews on all topics concerning structure and bonding. With over 50 years of history, the series has developed from covering theoretical methods for simple molecules to more complex systems.

Topics addressed in the series now include the design and engineering of molecular solids such as molecular machines, surfaces, two dimensional materials, metal clusters and supramolecular species based either on complementary hydrogen bonding networks or metal coordination centers in metal-organic framework materials (MOFs). Also of interest is the study of reaction coordinates of organometallic transformations and catalytic processes, and the electronic properties of metal ions involved in important biochemical enzymatic reactions.

《布局与键合》是一本怪异地将期刊和册本情势连系起来的出书物。该系列分为专题卷，颁发有关布局和键合的一切主题的深切和批评性批评。该系列已有 50 多年的汗青，从涵盖简略份子的实际体例成长到更庞杂的系统。

该系列中会商的主题此刻包含份子固体的设想和工程，比方基于互补氢键收集或金属无机骨架资料 (MOF) 中的金属配位中间的份子机械、外表、二维资料、金属簇和超份子物种。一样使人感乐趣的是无机金属转化和催化进程的反应坐标研讨，和到场主要生化酶促反应的金属离子的电子特征。

《Structure And Bonding》(布局与粘合)编辑部通信体例为SPRINGER-VERLAG BERLIN, HEIDELBERGER PLATZ 3, BERLIN, GERMANY, D-14197。若是您须要辅佐投稿或润稿办事，您可以或许征询咱们的客服教员。咱们专一于期刊征询办事十年，熟习颁发政策，可为您供给一对一投稿指点，防止您在投稿时频仍碰鼻，节流您的可贵时候，有用晋升颁发机率，确保SCI检索（检索不了全额退款）。咱们视诺言为生命，多方面确保文章宁静失密，在任何环境下都不会泄漏您的小我信息或稿件内容。